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Multi-chip module and single-chip module for chips and proximity connectors
Multi-chip module and single-chip module for chips and proximity connectors
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机译:用于芯片和接近连接器的多芯片模块和单芯片模块
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摘要
A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.
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