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ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPLYING ADVANCED POLISH ENDPOINT SYSTEM FEEDBACK
ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPLYING ADVANCED POLISH ENDPOINT SYSTEM FEEDBACK
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机译：通过应用先进的波兰终点系统反馈来进行先进的自动沉积物轮廓定位和控制
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摘要
The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system.
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