首页> 外国专利> Heat conduction bus, particularly for a microprocessor-based computation unit

Heat conduction bus, particularly for a microprocessor-based computation unit

机译:导热总线,特别是用于基于微处理器的计算单元

摘要

A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip (1) provided with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged so as to channel and evacuate the thermal energy drained by the tabs (7-12) and passing through the strip (1). The heat conduction bus includes, at least in line with each of the tabs (11, 12) geometrically the closest to the collector (4), an opening (13, 14) provided in the strip (1) near to the tab (11, 12), so as to be located interposed between the tab and the collector (4) and to form an obstacle opposing the direct routing of the thermal energy between this tab (11, 12) and the collector.
机译:尤其是用于基于微处理器的计算单元的导热总线包括单个起始端,设有多个凸片( 7 )的导热条( 1 ) - 12 )用于焊接到可能会变热的电子组件的连接端子,集电极( 4 )连接到条带( 1 )并布置为引导和排空由舌片( 7 - 12 )排出并穿过条带( 1 )。导热母线至少在几何上最接近集热器( 4 )的每个接片( 11,12 )中均包括一个开口(设置在靠近标签( 11,12 )的条( 1 )中的13、14 )中,并位于标签和标签之间收集器( 4 )并形成一个障碍,以阻止热能在此凸舌( 11,12 )和收集器之间直接路由。

著录项

  • 公开/公告号US7599186B2

    专利类型

  • 公开/公告日2009-10-06

    原文格式PDF

  • 申请/专利权人 PHILIPPE GARDIN;

    申请/专利号US20070944500

  • 发明设计人 PHILIPPE GARDIN;

    申请日2007-11-23

  • 分类号H05K7/20;F28F7/00;

  • 国家 US

  • 入库时间 2022-08-21 19:30:33

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号