Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives

摘要

This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including:(I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule,(II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule,(III) a hydrosilylation catalyst,(IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both,(V) an unsaturated ester-functional compound, and(VI) an adhesion promoter.The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.