首页> 外国专利> Method of fabricating strained-silicon transistors and strained-silicon CMOS transistors

Method of fabricating strained-silicon transistors and strained-silicon CMOS transistors

机译:应变硅晶体管的制造方法及应变硅CMOS晶体管

摘要

A method of fabricating strained-silicon transistors includes providing a semiconductor substrate, in which the semiconductor substrate contains a gate structure thereon; performing an etching process to form two recesses corresponding to the gate structure within the semiconductor substrate; performing an oxygen flush on the semiconductor substrate; performing a cleaning process on the semiconductor substrate; and performing a selective epitaxial growth (SEG) to form an epitaxial layer in each recess for forming a source/drain region.
机译:一种制造应变硅晶体管的方法,包括提供半导体衬底,其中所述半导体衬底上包含栅极结构;进行蚀刻工艺以形成与半导体衬底内的栅极结构相对应的两个凹槽;在半导体衬底上进行氧冲洗;在半导体衬底上执行清洁工艺;进行选择性外延生长(SEG)以在每个凹槽中形成外延层,以形成源/漏区。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号