首页> 外国专利> Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

机译:制造用作较大电路化基板的一部分的电容性基板的方法,制造所述电路化基板的方法以及制造包括所述电路化基板的信息处理系统的方法

摘要

A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
机译:一种形成电容性基板的方法,其中将至少一个材料的电容性电介质层丝网印刷或喷墨印刷到导体上,然后对该基板进行进一步处理,包括添加通孔以耦合基板中的选定元素以形成至少两个电容器作为衬底的内部元件。可以将电容性基板并入较大的电路化基板内,例如以形成电组件。还提供一种制造包括这种基板的信息处理系统的方法。

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