首页> 外国专利> Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit

Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit

机译:半导体集成电路的结构分析程序,结构分析方法,结构分析装置以及制造工艺

摘要

A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern and a thickness of each layer of the structure. A three-dimensional model is produced by adding the designated thickness of each layer to the material arrangement pattern of the layer so as to make the material arrangement pattern three-dimensional and stacking the three-dimensionalized material arrangement pattern of each layer. A finite element model is produced by dividing the three-dimensional model into a plurality of voxels. The computer performs structural analysis based on the produced finite element model. Thereby, an analysis result of a multilayer structure defined by the two-dimensional model is obtained.
机译:一种结构分析程序,可以根据表示二维形状的数据,根据有限元方法轻松进行结构分析。响应于操纵输入来产生结构的二维模型,该操纵输入指定了材料布置图案和结构的每一层的厚度。通过将每层的指定厚度添加到该层的材料布置图案以使材料布置图案为三维并堆叠每层的三维材料布置图案来产生三维模型。通过将三维模型划分为多个体素来生成有限元模型。计算机根据所产生的有限元模型进行结构分析。由此,获得了由二维模型定义的多层结构的分析结果。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号