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Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit
Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit
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机译:半导体集成电路的结构分析程序,结构分析方法,结构分析装置以及制造工艺
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摘要
A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern and a thickness of each layer of the structure. A three-dimensional model is produced by adding the designated thickness of each layer to the material arrangement pattern of the layer so as to make the material arrangement pattern three-dimensional and stacking the three-dimensionalized material arrangement pattern of each layer. A finite element model is produced by dividing the three-dimensional model into a plurality of voxels. The computer performs structural analysis based on the produced finite element model. Thereby, an analysis result of a multilayer structure defined by the two-dimensional model is obtained.
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