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Low power on-chip global interconnects

机译:低功耗片上全局互连

摘要

An apparatus including a first circuit, a second circuit and a third circuit. The first circuit may be configured to (a) receive (i) a plurality of input signals and (ii) a clock signal and (b) present (i) a plurality of low-swing differential signals and (ii) a full-swing differential signal. The second circuit may be configured to (a) receive (i) the plurality of low-swing differential signals, (ii) the full-swing differential signal and (iii) the clock signal and (b) present a plurality of output signals. The third circuit may be configured to communicate the plurality of low-swing differential signals and the full-swing differential signal from the first circuit to the second circuit. The third circuit may be further configured to generate a local clock in response to the full-swing differential signal.
机译:一种设备,包括第一电路,第二电路和第三电路。第一电路可以被配置为(a)接收(i)多个输入信号和(ii)时钟信号,并且(b)存在(i)多个低摆幅差分信号和(ii)全摆幅。差分信号。第二电路可以被配置为(a)接收(i)多个低摆幅差分信号,(ii)全摆幅差分信号和(iii)时钟信号,以及(b)呈现多个输出信号。第三电路可以被配置为将多个低摆幅差分信号和全摆幅差分信号从第一电路传送到第二电路。第三电路可以进一步被配置为响应于全摆幅差分信号生成本地时钟。

著录项

  • 公开/公告号US7545205B2

    专利类型

  • 公开/公告日2009-06-09

    原文格式PDF

  • 申请/专利权人 ROBIN TANG;EPHREM C. WU;

    申请/专利号US20070924791

  • 发明设计人 ROBIN TANG;EPHREM C. WU;

    申请日2007-10-26

  • 分类号H01L25/00;

  • 国家 US

  • 入库时间 2022-08-21 19:29:13

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