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Device and method for improving interface adhesion in thin film structures
Device and method for improving interface adhesion in thin film structures
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机译:用于改善薄膜结构中的界面粘附力的装置和方法
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摘要
A device and method for improving adhesion for thin film layers includes applying a diblock copolymer on a surface where adhesion to subsequent layers is needed and curing the diblock copolymer. Pores are formed in the diblock copolymer by treating the diblock copolymer with a solvent. The surface is etched through the pores of the diblock copolymer to form adhesion promoting features. The diblock copolymer is removed, and a layer is deposited on the surface wherein the adhesion promoting features are employed to promote adhesion between the layer and the surface.
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