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CMOS (Complementary metal oxide semiconductor) technology with leakage current mitigation

机译:CMOS(互补金属氧化物半导体)技术,可降低漏电流

摘要

A method for forming semiconductor transistor. The method comprises providing a structure including (a) a semiconductor region, and (b) first and second dopant source regions on and in direct physical contact with the semiconductor region, wherein each region of the first and second dopant source regions comprises a dielectric material which contains dopants; causing the dopants to diffuse from the first and second dopant source regions into the semiconductor region so as to form first and second source/drain extension regions, respectively, wherein the first and second source/drain extension regions define a channel region disposed between; forming a gate dielectric region on a channel region; and forming a gate region on the gate dielectric region, wherein the gate dielectric region electrically insulates the gate region from the channel region.
机译:一种形成半导体晶体管的方法。该方法包括提供一种结构,该结构包括(a)半导体区域,以及(b)在半导体区域上并与半导体区域直接物理接触的第一和第二掺杂剂源区域,其中第一和第二掺杂剂源区域的每个区域包括介电材料。其中包含掺杂剂;使掺杂剂从第一掺杂剂源区和第二掺杂剂源区扩散到半导体区中,以分别形成第一源极/漏极扩展区和第二源极/漏极扩展区,其中第一源极/漏极扩展区和第二源极/漏极扩展区限定设置在它们之间的沟道区;在沟道区上形成栅介电区;在所述栅极电介质区域上形成栅极区域,其中,所述栅极电介质区域使所述栅极区域与所述沟道区域电绝缘。

著录项

  • 公开/公告号US7462528B2

    专利类型

  • 公开/公告日2008-12-09

    原文格式PDF

  • 申请/专利权人 ANTHONY C. SPERANZA;

    申请/专利号US20070759472

  • 发明设计人 ANTHONY C. SPERANZA;

    申请日2007-06-07

  • 分类号H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-21 19:28:46

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