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EFFICIENT ANALYSIS OF ORGANIC ADDITIVES IN AN ACID COPPER PLATING BATH

机译:酸性铜镀液中有机添加剂的高效分析

摘要

Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first an the suppressor concentration in the resulting measurement solution is adjusted to a predetermined value corresponding to full suppression. This fully-suppressed solution is then used as the background electrolyte for the anti-suppressor analysis. This integrated analysis provides results comparable to those obtained with cell cleaning and rinsing between the analyses but significantl reduces the analysis time, consumption of expensive chemicals, and quality of hazardous waste generated. The figure shows a plot o Ar for a fully-suppressed supporting electrolyte of a commercial acid copper bath vs. volume fraction of anti-suppressor (accelerator) additive.
机译:通过循环伏安溶出(CVS)方法分析酸性硫酸铜电镀液中的抑制剂和抗抑制剂添加剂,而无需在两次分析之间清洗或冲洗细胞。首先进行抑制物分析,然后将所得测量溶液中的抑制物浓度调节至对应于完全抑制的预定值。然后将这种完全抑制的溶液用作背景电解质进行抗抑制剂分析。这种综合分析提供的结果与两次分析之间进行细胞清洁和漂洗所获得的结果相当,但是显着减少了分析时间,昂贵化学药品的消耗以及所产生危险废物的质量。该图示出了商用酸铜浴的完全抑制的支持电解质的Ar相对于抗抑制剂(促进剂)添加剂的体积分数的图。

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