首页> 外国专利> METHODS FOR MANUFACTURING LAMINATE, DEVICE APPLIED HEREWITH, LAMINATE OBTAINED HEREWITH, METHOD FOR ENCASING SUBSTRATES AND ENCASED SUBSTRATE OBTAINED HEREWITH

METHODS FOR MANUFACTURING LAMINATE, DEVICE APPLIED HEREWITH, LAMINATE OBTAINED HEREWITH, METHOD FOR ENCASING SUBSTRATES AND ENCASED SUBSTRATE OBTAINED HEREWITH

机译:制造叠层的方法,设备应用的继承,叠层获得的继承,封装衬底的方法和获得的衬底继承的继承

摘要

Method for manufacturing laminate which can be applied for encasing substrates (40), wherein the method comprises at least the step of performing a press treatment with a press element (4-25) provided with recesses (29) and/or protrusions (30), with the characteristic that at least at the surface (32) of the laminate (1), a structure of impressions is formed be means of the resesses and/or protrusions, wherein said impressions substantially follow said pattern. The invention relates also to a device that can be applied herewith, and laminates which can be obtained by such method. The invention also relates to a method for encasing substrates and to such encased substrates.
机译:用于制造可用于封装基板(40)的层压板的方法,其中,该方法至少包括以下步骤:利用设有凹部(29)和/或突起(30)的压紧元件(4-25)进行压紧处理。具有至少在层压体(1)的表面(32)处的特征,该特征是通过刻痕和/或突起形成压痕的结构,其中,所述压痕基本上遵循所述图案。本发明还涉及可与其一起使用的装置,以及可通过这种方法获得的层压材料。本发明还涉及一种封装基板的方法以及这种封装的基板。

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