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ELECTRONIC COMPONENT TESTING APPARATUS, ELECTRONIC COMPONENT TESTING SYSTEM AND ELECTRONIC COMPONENT TESTING METHOD

机译:电子元件测试装置,电子元件测试系统和电子元件测试方法

摘要

An electronic component testing apparatus is provided with a first reversing apparatus (220) and a pressing apparatus (250). The reversing apparatus places a customer tray (5) and a contact plate (6A), which is exclusively used for testing, one over another, and reverses them just before testing an IC device so as to transfer the IC device from the customer tray (5) to the contact plate (6A). The pressing apparatus presses the IC device to a socket (41) of the test head (4) in a status where the IC device is held to the contact plate (6A).
机译:电子零件测试装置具备第一反转装置(220)和按压装置(250)。反转装置将专用于测试的客户托盘(5)和接触板(6A)相互叠放,并在测试IC器件之前将它们反转以从客户托盘转移IC器件( 5)接触板(6A)。按压装置在将IC装置保持在接触板(6A)上的状态下,将IC装置按压至测试头(4)的插座(41)。

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