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CERAMIC POWDER MOLDING, CERAMIC BURNING PRODUCT, AND PROCESS FOR PRODUCING CERAMIC POWDER MOLDING

机译:陶瓷粉末成型,陶瓷燃烧产品以及生产陶瓷粉末成型的方法

摘要

A ceramic powder molding (10) which contains a conductor powder molding (12) embedded therein. The ceramic powder molding (10) is obtained by molding a conductor paste (14) comprising a resin and a powder of at least one metal selected among silver (Ag)-, gold (Au)-, and copper (Cu)-based metals into a given shape, curing it, subsequently disposing the cured shape in a casting mold (16), pouring a slurry (18) comprising a thermosetting resin, a ceramic powder, and a solvent into the casting mold (16), and then curing the slurry. The resin to be used in the conductor paste (14) preferably is a thermosetting resin. This thermosetting resin may be a phenolic resin or a self-reactive resorcinol resin. The thermosetting resin to be used in the slurry (18) preferably is a polyurethane resin.
机译:一种陶瓷粉末成型件(10),其内嵌有导体粉末成型件(12)。陶瓷粉末成型体(10)是通过将包含树脂和选自银(Ag)-,金(Au)-和铜(Cu)的金属中的至少一种金属的粉末的导体浆料(14)成型而获得的。成型为给定形状,然后将其固化,然后将固化后的形状放置在铸模(16)中,将包含热固性树脂,陶瓷粉和溶剂的浆料(18)倒入铸模(16)中,然后固化泥浆。导体浆料(14)中使用的树脂优选为热固性树脂。该热固性树脂可以是酚醛树脂或自反应性间苯二酚树脂。浆料(18)中使用的热固性树脂优选为聚氨酯树脂。

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