首页> 外国专利> Addition curable liquid silicone rubber composition for injection molding, method of regulating fluidity of the composition, and method of injection molding silicone rubber composition

Addition curable liquid silicone rubber composition for injection molding, method of regulating fluidity of the composition, and method of injection molding silicone rubber composition

机译:用于注射成型的可加成固化的液态硅橡胶组合物,调节组合物的流动性的方法以及注射成型的硅橡胶组合物的方法

摘要

An addition curable liquid silicone rubber composition for injection molding is provided. The composition comprises (A) an organopolysiloxane containing at least two Si-bonded alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms within each molecule, (C) a fumed silica with a BET specific surface area of 50 m2/g or greater, and (D) an addition reaction catalyst, and exhibiting fluidity such that, at 23°C, the viscosity at a shear velocity of 0.9 s-1 is not higher than 1,000 Pa·s, and the ratio between the viscosity at a shear velocity of 100 s-1 and the viscosity at a shear velocity of 200 s-1 is not higher than 3.5. The composition is resistant to decreases in viscosity of the rubber material under high shear velocity, and generates no burrs on the molded product.
机译:提供了用于注射成型的可加成固化的液态硅橡胶组合物。该组合物包含(A)在每个分子内包含至少两个与硅键合的烯基的有机聚硅氧烷,(B)在每个分子内包含至少两个与硅键合的氢原子的有机氢聚硅氧烷,(C)具有BET比表面的热解法二氧化硅面积为50 m 2 / g或更大,并且(D)加成反应催化剂,并表现出流动性,使得在23°C时剪切速率为0.9 s - 1 不大于1,000 Pa·s,剪切速度为100 s -1 时的粘度与剪切速度为200 s -时的粘度之比1 不大于3.5。该组合物在高剪切速度下耐橡胶材料的粘度降低,并且在模制品上不产生毛刺。

著录项

  • 公开/公告号EP1785454B1

    专利类型

  • 公开/公告日2008-12-31

    原文格式PDF

  • 申请/专利权人 SHINETSU CHEMICAL CO;

    申请/专利号EP20060255717

  • 发明设计人 SHUDO SHIGEKISHIN-ETSU CHEMICAL CO. LTD.;

    申请日2006-11-06

  • 分类号C08L83/04;C08L83/05;C08L83/07;C08K3/36;

  • 国家 EP

  • 入库时间 2022-08-21 19:20:14

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