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THERMOCONDUCTIMETRIC ANALYZER FOR SOLDERING PROCESS IMPROVEMENT
THERMOCONDUCTIMETRIC ANALYZER FOR SOLDERING PROCESS IMPROVEMENT
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机译:热导时间分析仪,用于焊接工艺改进
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摘要
Performance of a flux in a soldering process is assessed by monitoring the activity of the flux via its electrical conductance measured using a probe having interdigitated metallic traces and a temperature sensor. The measured conductance- temperature time profile provides information useful for selecting a suitable flux formulation and soldering conditions for a given application, for determining the cause of soldering process problems, and for developing improved flux formulations.
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