MICROMECHANICAL OR NANOMECHANICAL DEVICE WITH ANTI-BONDING INTERFACE LAYER

摘要

The invention relates to a micromechanical and/or nanomechanical device (100) comprising a first member (108) containing a semiconductor and mobile relative to a second member (106) of the device also containing a semiconductor, the first mobile member being capable of movement opposite a cavity formed in the device, wherein walls of the first mobile member, provided opposite a wall of the second member and a wall of the cavity containing a semiconductor material, can be brought into contact with said walls of the second member and the cavity, and said walls of the first mobile member, of the second member and of the cavity are at least partially coated with a conducting anti-bonding material (118) so that the conducting anti-bonding material covering said walls of the second member and of the cavity is provided at least partially opposite the conducting anti-bonding material covering said walls of the first mobile member.