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CARRIER FOR DOUBLE SIDE POLISHING MACHINE AND DOUBLE SIDE POLISHING MACHINE EMPLOYING IT, AND DOUBLE SIDE POLISHING METHOD
CARRIER FOR DOUBLE SIDE POLISHING MACHINE AND DOUBLE SIDE POLISHING MACHINE EMPLOYING IT, AND DOUBLE SIDE POLISHING METHOD
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机译:用于双面抛光机和双面抛光机的载体及其双面抛光方法
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摘要
The present invention is a carrier for a double-side polishing apparatus in which, in a double-side polishing apparatus, the carrier is set between upper and lower turn tables to which polishing pads are attached, and a holding hole to hold a wafer sandwiched between the upper and lower turn tables in polishing is formed in the carrier, wherein the carrier is made of titanium. Thereby, there is provided a carrier for a double-side polishing apparatus in which the strength of the carrier itself is high, and at the same time, contamination of a wafer such as a silicon wafer by impurities is suppressed, and sag in a peripheral portion of the wafer after being polished is suppressed.
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