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CATHODE CONTACT ROLL FOR ELECTROPLATING AND CU PLATING METHOD FOR FPCB USING ITS

机译:用于FPCB的电镀和铜电镀的阴极接触辊

摘要

A cathode contact roll for electroplating and a cu plating method for fpcb using thereof are provided to improve a form of the contact roll for conducting is performed and the plating efficiency for the formation of the circuit pattern and accuracy are enhanced on the soft film. A cathode contact roll(100) for electroplating having roll body(110) is comprised as follows: a base(111) is formed in two part of the roll body and is protruded from the outer circumference of the roll body; and a meshing projection(112) of the saw tooth is protruded according to the girth of the external periphery of the base and is shaped meshed in the combining hole of the soft film is equipped into one body. The cathode contact roll for the electroplating in which the copper coating of the soft film is plated with electrodeposition.
机译:提供用于电镀的阴极接触辊和使用其的用于fpcb的Cu电镀方法,以改善用于导电的接触辊的形式,并提高了在软膜上形成电路图案的电镀效率和精度。具有辊体(110)的电镀用阴极接触辊(100)构成如下:在辊体的两部分形成有基体(111),该基体(111)从辊体的外周突出。锯齿的啮合突起(112)根据基部的外周的周长而突出,并且在软膜的结合孔中啮合成一体。用于电镀的阴极接触辊,其中软膜的铜涂层电镀有电沉积层。

著录项

  • 公开/公告号KR20080099634A

    专利类型

  • 公开/公告日2008-11-13

    原文格式PDF

  • 申请/专利权人 AHN WOO YOUNG;

    申请/专利号KR20070045436

  • 发明设计人 AHN WOO YOUNG;

    申请日2007-05-10

  • 分类号C25D17/10;C25D17;

  • 国家 KR

  • 入库时间 2022-08-21 19:14:41

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