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METHOD FOR MONITORING SOLDER OF FBGA-TYPE FPGA ONTO PCB

机译:FBGA型FPGA在PCB上焊锡的监控方法

摘要

FPGA the present invention and PCB solder contacts a printed circuit board be equipped with multiple FPGA how inspection state and to a device that. ;Multiple FPGA data are installed on a printed circuit board compared with testing data together is selected by the other FPGA read and write data to determined in a single FPGA in the method for the printed circuit board of the solder contact and FBGA types according to the present invention and device that check FPGA, it reads, the accurate and easy FBGA types of FPGA solder contacts and printed circuit board, FPGA and printed circuit can determine the contact state of solder substrate.
机译:本发明的FPGA和PCB焊料接触印刷电路板配备有多个FPGA如何检查状态以及到一个器件。 ;在印刷电路板上安装多个FPGA数据,然后与其他FPGA一起选择测试数据一起选择另一种读写数据,以在单个FPGA中根据印刷电路板的焊点和FBGA类型根据方法确定本发明和一种检查FPGA的装置,它读取,准确和容易的FBGA类型的FPGA焊料触点和印刷电路板,FPGA和印刷电路可以确定焊料衬底的接触状态。

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