首页> 外国专利> LPCVD APPARATUS AND METHOD FOR FABRICATING POLY SILICON ON WAFER USING THE LPCVD

LPCVD APPARATUS AND METHOD FOR FABRICATING POLY SILICON ON WAFER USING THE LPCVD

机译:LPCVD装置和使用LPCVD在晶片上制造多晶硅的方法

摘要

In the polysilicon deposition process of using LPCVD in the semiconductor device fabrication, the LPCVD apparatus and the poly silicone deposition method for suppressing the particle generation with the reactive inhibitor are provided. As the method for preventing the particle generation in the LPCVD apparatus in the polysilicon deposition, a step for flowing the inert gas to the process tube(200) to wafer(204) phase particle inhibitor; a step for inflowing the silicon source gas for the polysilicon deposition in the state where the inert gas is flowed in within the process tube; a step for creating polysilicon it inflows the doping gas within the process tube in which the silicon source gas is inflowed; and a step for forming the polysilicon layer of the thickness suppressing and is uniform with on wafer the aberrant growth of the grain size of polysilicon by the inert gas are performed.
机译:在半导体器件制造中使用LPCVD的多晶硅沉积工艺中,提供了LPCVD设备和用于利用反应性抑制剂抑制颗粒产生的聚硅氧烷沉积方法。作为防止在多晶硅沉积中在LPCVD装置中产生颗粒的方法,是使惰性气体流向处理管(200)到晶片(204)相颗粒抑制剂的步骤。在惰性气体在处理管内流入的状态下,流入用于多晶硅沉积的硅源气体的步骤;产生多晶硅的步骤是使掺杂气体流入工艺管中,其中有硅源气体流入其中。进行形成厚度被抑制且与晶片均匀的多晶硅层的步骤,该多晶硅层通过惰性气体异常地生长。

著录项

  • 公开/公告号KR20080110094A

    专利类型

  • 公开/公告日2008-12-18

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20070058422

  • 发明设计人 KIM TAE GIL;

    申请日2007-06-14

  • 分类号C23C16/24;

  • 国家 KR

  • 入库时间 2022-08-21 19:14:31

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