首页> 外国专利> METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND METALLIC WIRING PATTERN OF FLEXIBLE PRINTED CIRCUIT BOARD USING THEREOF

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND METALLIC WIRING PATTERN OF FLEXIBLE PRINTED CIRCUIT BOARD USING THEREOF

机译:制造柔性印刷电路板的方法和使用该方法的柔性印刷电路板的金属配线图案

摘要

A method for manufacturing a flexible printed circuit board and a metal wiring pattern of the flexible printed circuit board are provided to prevent oxidation of a wiring pattern when the copper plating layer is exposed to the air and stored for a long time. A flexible copper-clad laminated board is prepared(S10). A photoresist is coated to implement an engraved circuit pattern on a metal conductive layer(S20). The exposure and development are performed(S30,S40). A first plating layer is formed by plating the copper on the metal conductive layer(S50). The engraved pattern of the photoresist is removed(S60). The metal conductive layer exposed except the first plating layer is removed by soft etching(S70). The wiring pattern is stacked by successively plating the nickel plating layer as the second plating layer and the gold plating layer as the third plating layer on the first plating layer(S80).
机译:提供一种用于制造柔性印刷电路板的方法和该柔性印刷电路板的金属布线图案,以防止当铜镀层暴露于空气并长时间存储时布线图案的氧化。制备柔性覆铜层压板(S10)。涂覆光致抗蚀剂以在金属导电层上实现雕刻的电路图案(S20)。进行曝光和显影(S30,S40)。通过在金属导电层上镀铜来形成第一镀层(S50)。去除光刻胶的雕刻图案(S60)。通过软蚀刻去除除了第一镀层之外暴露的金属导电层(S70)。通过在第一镀覆层上依次镀覆作为第二镀覆层的镍镀层和作为第三镀覆层的金镀层来堆叠布线图案(S80)。

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