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METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND METALLIC WIRING PATTERN OF FLEXIBLE PRINTED CIRCUIT BOARD USING THEREOF
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND METALLIC WIRING PATTERN OF FLEXIBLE PRINTED CIRCUIT BOARD USING THEREOF
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机译:制造柔性印刷电路板的方法和使用该方法的柔性印刷电路板的金属配线图案
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摘要
A method for manufacturing a flexible printed circuit board and a metal wiring pattern of the flexible printed circuit board are provided to prevent oxidation of a wiring pattern when the copper plating layer is exposed to the air and stored for a long time. A flexible copper-clad laminated board is prepared(S10). A photoresist is coated to implement an engraved circuit pattern on a metal conductive layer(S20). The exposure and development are performed(S30,S40). A first plating layer is formed by plating the copper on the metal conductive layer(S50). The engraved pattern of the photoresist is removed(S60). The metal conductive layer exposed except the first plating layer is removed by soft etching(S70). The wiring pattern is stacked by successively plating the nickel plating layer as the second plating layer and the gold plating layer as the third plating layer on the first plating layer(S80).
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