MANUFACTURING METHOD OF PACKAGE IN CAMERA MODULE USING PCB PANEL AND PCB PANEL

摘要

A kind of method, for being provided to lower manufacturing cost by one outer shape processing process of removal by using the packet of PCB (Printed Circuit Board) panel and the manufacture of its PCB panel in a camera module and increasing the production efficiency of every PCB panels by cumulative cutting accuracy. One unit substrate array is formed by multiple cell boards are vertically arranged including the circuit pattern on a PCB. Manufacturing to one PCB panel-levels can be by setting unit substrate array. By using a dicing saw (S130), a part between neighboring units substrate array is cut. One packet array is formed by installation section, is used to form a camera module in each unit substrate of PCB panels (S160). Each packet, which separates, cuts neighbouring packet (S170).