SUPPORT PLATE STRUCTURE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF SUPPORTING AN ELECTRONIC DEVICE ON A SUBSTRATE, CAPABLE OF IMPROVING A LIFETIME AND PERFORMANCE OF THE ELECTRONIC DEVICE

摘要

PURPOSE: A support plate structure and a manufacturing method thereof are provided to discharge the heat generated in the electronic device.;CONSTITUTION: A heat conductive plate has an upper side(101) and a lower side(102). A first ceramic layer(110) is arranged in the upper side of the heat conductive plate. An adiabatic conductive layer(120) is arranged in the first ceramic layer. A conductive pattern(135) is formed on the adiabatic conductive layer.;COPYRIGHT KIPO 2010