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TEMPERATURE SENSING DEVICE AND CHAMBER HAVING TEMPERATURE SENSING DEVICE TO REDUCE THE FAILURE RATE

机译:温度感测装置和具有温度感测装置的腔室以降低故障率

摘要

PURPOSE: A temperature sensing device and chamber having temperature sensing device are provided to accurately measure the temperature required for the deposition process of a substrate.;CONSTITUTION: The temperature sensing device and chamber having temperature sensing device includes the chamber(100) for performing the deposition process of a substrate and the temperature measuring apparatus which measures the process space of the chamber and temperature of the substrate surface. The fixing unit(210) includes the fixing plate and is fixed at the upper of the chamber. The moving element(220) is combined to the post. The driving part(230) is prepared in the fixing unit. The temperature measuring part(240) measures the temperature of the inside of chamber.;COPYRIGHT KIPO 2010
机译:目的:提供温度感测装置和具有温度感测装置的腔室,以准确地测量衬底的沉积过程所需的温度。组成:温度感测装置和具有温度感测装置的腔室包括用于执行基板的腔室(100)。基板的沉积处理和温度测量装置,该温度测量装置测量腔室的处理空间和基板表面的温度。固定单元(210)包括固定板并且被固定在腔室的上部。移动元件(220)被结合到支柱。在定影单元中准备驱动部分(230)。温度测量部件(240)测量室内的温度。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090107708A

    专利类型

  • 公开/公告日2009-10-14

    原文格式PDF

  • 申请/专利权人 ADP ENGINEERING CO. LTD.;

    申请/专利号KR20080033115

  • 发明设计人 AN YOUNG UNG;JUNG KI TAEK;

    申请日2008-04-10

  • 分类号C23C14/24;H05B33/10;H01L51/56;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:27

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