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GROUP III NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE CAPABLE OF MINIMIZING TOTAL REFLECTION OF A LIGHT GENERATED INSIDE A LIGHT EMITTING DIODE, AND A MANUFACTURING METHOD THEREOF
GROUP III NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE CAPABLE OF MINIMIZING TOTAL REFLECTION OF A LIGHT GENERATED INSIDE A LIGHT EMITTING DIODE, AND A MANUFACTURING METHOD THEREOF
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机译:可最小化在发光二极管内产生的光的总反射的,基于III族氮化物的半导体发光二极管及其制造方法
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PURPOSE: A group III nitride based semiconductor light emitting diode and a manufacturing method thereof are provided to improve luminance of a light emitting diode by minimizing total reflection of a light generated inside the light emitting diode.;CONSTITUTION: A manufacturing method of a group III nitride based semiconductor light emitting diode comprises the following steps: a step for preparing a growth substrate for growing a light emitting structure; a step for forming the light emitting structure on the growth substrate; a step for forming a transparent ohmic contact current spreading layer on a top surface of the light emitting structure; a step for forming a wafer bonding layer on a top surface of the transparent ohmic contact current spreading layer; a step for preparing a patterned supporting substrate; a step for forming a flattening layer on a top surface of the patterned supporting substrate; a step for forming a wafer bonding layer on a top surface of the flattening layer; a step for forming a complex body by contacting the two wafer bonding layers; a step for separating the growth substrate from the complex body; a step for forming a p-type ohmic contact electrode and electrode pad(302) on a top surface of the transparent ohmic contact current spreading layer(206); and a step for forming a partial n-type electrode structure(301).;COPYRIGHT KIPO 2010
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