首页> 外国专利> GROUP III NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE CAPABLE OF MINIMIZING TOTAL REFLECTION OF A LIGHT GENERATED INSIDE A LIGHT EMITTING DIODE, AND A MANUFACTURING METHOD THEREOF

GROUP III NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE CAPABLE OF MINIMIZING TOTAL REFLECTION OF A LIGHT GENERATED INSIDE A LIGHT EMITTING DIODE, AND A MANUFACTURING METHOD THEREOF

机译:可最小化在发光二极管内产生的光的总反射的,基于III族氮化物的半导体发光二极管及其制造方法

摘要

PURPOSE: A group III nitride based semiconductor light emitting diode and a manufacturing method thereof are provided to improve luminance of a light emitting diode by minimizing total reflection of a light generated inside the light emitting diode.;CONSTITUTION: A manufacturing method of a group III nitride based semiconductor light emitting diode comprises the following steps: a step for preparing a growth substrate for growing a light emitting structure; a step for forming the light emitting structure on the growth substrate; a step for forming a transparent ohmic contact current spreading layer on a top surface of the light emitting structure; a step for forming a wafer bonding layer on a top surface of the transparent ohmic contact current spreading layer; a step for preparing a patterned supporting substrate; a step for forming a flattening layer on a top surface of the patterned supporting substrate; a step for forming a wafer bonding layer on a top surface of the flattening layer; a step for forming a complex body by contacting the two wafer bonding layers; a step for separating the growth substrate from the complex body; a step for forming a p-type ohmic contact electrode and electrode pad(302) on a top surface of the transparent ohmic contact current spreading layer(206); and a step for forming a partial n-type electrode structure(301).;COPYRIGHT KIPO 2010
机译:目的:提供一种基于III族氮化物的半导体发光二极管及其制造方法,以通过最小化发光二极管内部产生的光的全反射来提高发光二极管的亮度。;构成:III族的制造方法氮化物基半导体发光二极管包括以下步骤:准备用于生长发光结构的生长衬底的步骤;在生长衬底上形成发光结构的步骤;在发光结构的顶表面上形成透明的欧姆接触电流扩散层的步骤;在透明欧姆接触电流扩展层的顶面上形成晶片键合层的步骤;制备图案化支撑基板的步骤;在图案化的支撑基板的顶面上形成平坦化层的步骤;在平坦化层的上表面上形成晶片结合层的步骤;通过使两个晶片结合层接触而形成复合体的步骤;从复合体分离生长底物的步骤;在透明欧姆接触电流扩散层(206)的上表面上形成p型欧姆接触电极和电极焊盘(302)的步骤; ;以及形成部分n型电极结构的步骤(301)。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090112854A

    专利类型

  • 公开/公告日2009-10-29

    原文格式PDF

  • 申请/专利权人 SONG JUN O;

    申请/专利号KR20080038586

  • 发明设计人 SONG JUN O;

    申请日2008-04-25

  • 分类号H01L33/00;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:20

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号