NEW LEVELER FOR LEVELING AND CU ELECTRO DEPOSITION BY USING THE SAME

摘要

A leveling agent capable of performing superconformal deposition without fine defects on a trench with various aspect ratios and providing a flat copper thin film without a step height difference, a copper electroplating solution comprising the leveling agent, and a copper electroplating method using the copper electroplating solution are provided. A quarternary ammonium bromide leveling agent has an alcohol functional group used in copper electroplating. The leveling agent is benzyl-di-(3-hydroxypropyl)-methyl ammonium bromide. A copper electroplating solution comprises a quarternary ammonium bromide leveling agent having an alcohol functional group used in copper electroplating. The copper electroplating solution comprises: a basic copper electroplating solution including 40 g/L of copper(Cu), 10 g/L of sulfuric acid(H2SO4) and 50 ppm of chlorine ions(Cl^-); additives including 13.68 mg/L of bis(3-sulfopropyl)disulfide(SPS) as an accelerant and 2 ml/L of an Enthone VS solution as an inhibitor; and 20 mg/L of the prepared leveling agent. A copper electroplating method comprises performing an electrodeposition process using the copper electroplating solution comprising a quarternary ammonium bromide leveling agent having an alcohol functional group used in copper electroplating.