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thermosetting thick-film resistor paste and its manufacturing method and the thick-film resistor

机译:热固性厚膜电阻膏及其制造方法和厚膜电阻

摘要

A thermosetting paste for thick film resistor, manufacturing method thereof, and thick film resistor are provided to maintain high electric conductance by using filler having negative temperature coefficient of resistance or low coefficient of thermal expansion along with carbon black. A manufacturing method of thermosetting paste for thick film resistor comprises the following steps: a step for preparing for an organic resin(S210); a step for first-mixing the organic resin(S220); a step for second-mixing the organic resin(S230); and a step for performing three roll milling about the organic resin(S240). A carbon black is injected into a first-mixed organic resin. A deaeration and filtering processes are performed about a second-mixed organic resin.
机译:提供用于厚膜电阻器的热固性糊剂,其制造方法和厚膜电阻器,以通过使用具有负电阻温度系数或低热膨胀系数的填料与炭黑来保持高电导率。用于厚膜电阻器的热固性糊剂的制造方法包括以下步骤:准备有机树脂的步骤(S210);首先混合有机树脂的步骤(S220);第二混合有机树脂的步骤(S230);以及对有机树脂进行三辊研磨的步骤(S240)。将炭黑注入到第一混合有机树脂中。对第二混合的有机树脂进行脱气和过滤处理。

著录项

  • 公开/公告号KR100908609B1

    专利类型

  • 公开/公告日2009-07-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20070071141

  • 发明设计人 강남기;유명재;박성대;

    申请日2007-07-16

  • 分类号H01C7/00;

  • 国家 KR

  • 入库时间 2022-08-21 19:11:49

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