HEAT TREATMENT PLATE TEMPERATURE SETTING METHOD, HEAT TREATMENT PLATE TEMPERATURE SETTING APPARATUS, AND COMPUTER READABLE RECORDING MEDIUM WHEREIN PROGRAM IS RECORDED

摘要

The invention has the purpose of conducting the temperature setting of the heat plate such that the wafer is uniformly heated at the time of the actual heat treatment. The wafer for temperature measurement are measured, the wafer temperature of the heat treatment period until the actual heat treatment time of from immediately after the mounting on the hot plate has passed. The temperature setting parameters to calculate a correction value of the temperature setting parameters of a hot plate to determine the uniform suitability resistance of temperature, in the case of a negative determination result is used a correction value calculation model from the measurement results in the surface of the wafer from the temperature of the wafer in the heat treatment period provide for technical changes.