OXYLIN-5 RESIN AS MODIFIER FOR INCREASING HEAT RESISTANCE OF EPOXY COMPOUNDS FOR ANHYDRIDE SOLIDIFICATION

摘要

FIELD: chemistry.;SUBSTANCE: present invention pertains to use of Oxylin-5 resin as a modifier for increasing heat resistance of epoxy compounds. The modifier is added to epoxy compounds for anhydride solidification in quantity of 8-15 pts. wt. The invention increases heat resistance (as per Vic) of compounds, based on "ЭД-20" resin to 135°C, to 340°C for compounds based on "ЭХД" resin, and 190°C for compounds based on "УП-610" resin, with retention of deformation-strength properties of the solidified compound.;EFFECT: invention can be used as sealing and potting materials when making objects for different purposes, particularly organo- and glass-fibre reinforced plastics, in construction, aviation, automobile, aerospace and other industries.;1 tbl, 12 ex