首页> 外国专利> DEVELOPMENT METHOD OF INTEGRATION NO HAVING HOLES OF THIN DETAILS FOR APPLICATION ON IT OF METALLIC COATINGS AND DEVICE FOR ITS IPLEMENTATION

DEVELOPMENT METHOD OF INTEGRATION NO HAVING HOLES OF THIN DETAILS FOR APPLICATION ON IT OF METALLIC COATINGS AND DEVICE FOR ITS IPLEMENTATION

机译:用于金属涂层的无细微积分集成化开发方法及其装置

摘要

FIELD: metallurgy.;SUBSTANCE: invention relates to metallisation field on flat products and can be used during covering of medals, coins etc. by gold, silver, platinum metals, and also by other metals such methods as galvaniser or ion-plasma vacuum deposition. Method includes details fixation on support, excluding inter-ply shifting during the coating process, at that details are fixed on support in the form of flat plate with holes with point-contact by contour of support at amount of contact points more than two, and details are hold in fixed position ensured by dead load. Device contains current-carrying rods and fix supports for details placement, herewith fixing supports are implemented in the form of flat plates with holes, providing ability of details fixation ensured by its dead load excluding its dislocation during plating.;EFFECT: simplification of preparation of details assemblage and extraction of complete products, and also exclusion of plating defect formation during the process of its coating.;3 cl, 3 dwg, 3 ex
机译:技术领域本发明涉及扁平产品上的金属化领域,并且可以用在金,银,铂金属以及其他金属例如镀锌器或离子等离子体真空沉积的方法覆盖奖章,硬币等的过程中。 。该方法包括将细节固定在支撑件上,不包括涂层过程中的层间移动,此时,将细节固定在带有孔的平板形式的支撑件上,该孔通过支撑件的轮廓在两个以上的接触点处点接触。细节保持在固定位置,以确保自重。该装置包含载流杆和用于放置细节的固定支架,固定支架采用带孔平板形式实施,通过其静载荷确保了细节固定的能力,不包括电镀过程中的移位;效果:简化了制备详细说明了完整产品的组装和提取,并排除了其涂覆过程中镀层缺陷的形成。; 3 cl,3 dwg,3 ex

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