A method for the production of rigid - flexible printed circuit boards and printed circuit boards, with at least one rigid region and at least one flexible region

摘要

A method for the production of rigid - flexible printed circuit boards with at least one rigid region and at least one flexible region, with at least one a - or on both sides or provided with conductors rigid individual layer and with at least one a - or on both sides or provided with conductors flexible individual layer, wherein the rigid individual layer or the rigid individual layers and the flexible individual layer or the flexible individual layers initially extend over the entire printed circuit board and only in a subsequent step in the flexible region or in the flexible areas, a portion of the rigid individual layer is removed,in which case, first on at least one side of the rigid individual layer a liquid or flowable adhesive is applied and subsequently the flexible individual layer or the flexible individual layers is placed on the adhesive and then the rigid individual layer with the flexible individual layer or with the flexible individual layers is glued together by lamination or pressing,characterized by the,that the liquid or flowable adhesive on at least over the entire surface..