A process for producing a piezoelectric vibrating body, the piezoelectric vibrating body, the piezoelectric vibrator oscillator, electronic device and radio clock.

摘要

There is described a method for mass production of a piezoelectric vibrating body from a wafer (S) and claimed, in which a metal film deposited on both main surfaces of the wafer, and then pattern-wise, a narrow region of the metal film on the periphery of the wafer at a constant width (H) is removed. Then, the metal film is patterned uniformly provided with the outlines of generated piezoelectric vibration body. These outlines are then generated by wet etching, the zonally worn metal film as a mask. Finally, the remaining metal film mask is removed, and the piezoelectric vibration bodies produced are separated. The removal of the metal film on the edge of the wafer damage such as cracks, breaks and rough surfaces of the wafer, which might occur during the process, avoided.