Semiconductor device having semiconductor device components embedded in plastic package, array for a plurality of semiconductor devices, and methods for manufacturing semiconductor devices

摘要

The invention relates to a semiconductor device comprising semiconductor device components embedded in plastic housing composition. The semiconductor device components partly contain copper or have copper-containing coatings and/or coating structures. The copper-containing regions of the semiconductor device components have an adhesion promoting layer with copper(II) oxide whiskers on the surfaces that are in contact with the plastic housing composition.