Plate thickness measuring method for manufacturing process of e.g. chip board, involves providing sensor outside area for determination of spacer value such that spacer value of sensor is derived from another sensor

摘要

The method involves determining thickness of a plate (1) from a difference of a spacer value of a sensor (7a, 8a, 9a) to a normal defined with respect to a conveying path and a spacer value of the sensor to a surface of the plate in the area of the conveying path. Another sensor (6a, 6b) is provided outside the area for the determination of the spacer value of the former sensor to the defined normal in such a manner that the spacer value of the former sensor to the normal is derived from the spacer value of the latter sensor to the normal. An independent claim is also included for a device for performing a method for thickness measurement of a plate.