首页> 外国专利> Art for the deformation production in the case of silicon-based transistors by the use of implantation techniques for the production of a deformation induzier ends layer under the channel region

Art for the deformation production in the case of silicon-based transistors by the use of implantation techniques for the production of a deformation induzier ends layer under the channel region

机译:在硅基晶体管的情况下,通过使用注入技术在沟道区下方生产变形工业端层来生产变形的技术

摘要

By incorporation of a half conductor locations with the same value and a different covalent radius in the comparison to the base half conductor material by means of an ion implantation process can be a deformation induzier end material locally within a transistor during a suitable process step are arranged, as a result of which is not substantially to the total process complexity is helped and also the further processing of the semiconductor component is not affected. Thus, a high degree of flexibility with regard to improving the holding power transistor can be achieved in very local.
机译:通过与离子基体半导体材料相比,通过引入具有相同值和不同共价半径的半导体位置,可以通过离子注入工艺在适当的工艺步骤中局部地布置在晶体管内的变形工业终端材料。因此,这基本上不影响整个过程的复杂性,并且不影响半导体部件的进一步处理。因此,可以在非常局部的地方实现关于改善保持功率晶体管的高度灵活性。

著录项

  • 公开/公告号DE102007025336A1

    专利类型

  • 公开/公告日2008-12-04

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20071025336

  • 发明设计人

    申请日2007-05-31

  • 分类号H01L21/336;H01L21/8238;H01L29/78;H01L27/088;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:47

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