Workpiece i.e. semiconductor wafer, machining tool i.e. double side machining tool, has wear sensor with sections running out from machining surfaces plane, where electrical resistances of sections exhibit different temperature dependencies

摘要

The tool has a rotatably driven machining disk (1), whose machining surfaces (3) are formed by an abrasive lining (2). A wear sensor (6) is provided in the lining and is cut-off with the machining surfaces such that the sensor is carried by carrying the lining. The sensor includes sections extending away from a machining slot (4) and running out from a plane (E) of the machining surfaces, where electrical resistances of the sensor sections exhibit different temperature dependencies. A measuring device measures an electrical parameter correlating with the resistances of the sections.