Panel for use as module substrate of high-frequency device, has contact surfaces on upper sides of module sections, and connecting line electrically connecting test points or switching circuits in panel with each other

摘要

The panel has a multi-layered integrated structure, and a number of module sections (MA), where a switching circuit is attached to each module section. The circuit is separated into circuit blocks (SB1), is integrated into the panel, and is provided with passive components and circuit elements. Contact surfaces are provided on upper sides of each module section for assembly with discrete passive and active parts. A connecting line (VL) electrically connects two test points (TP1, TP2) or switching circuits in the panel with each other. An independent claim is also included for a method for testing an unloaded module substrate.