The present invention relates to a plurality of individual packages (1) each having a component assembly with at least one unhoused electronic component (6), in particular power component or power semiconductor component, in particular for high voltages greater than 1000 V, wherein the component (6) pads for electrical contacting (4) the component (6) and / or for attachment (5) of the component (6), as well as their production and use. It should be provided in such a cost-effective structure that the component assemblies are easily contacted electrically and / or easy to attach. For this purpose, each individual package (1) is standardized uniformly with respect to any properties, in particular a uniformly standardized with respect to any properties electrically isolated component sheathing (2) proposed. In this way, high-power semiconductor devices, especially for the high voltage range greater than 1000 V, can be easily created and used, for example, as an inverter, rectifier, DC-DC converter, frequency converter and the like.
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