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Thin medium i.e. silicon wafer, irradiating and medium penetration recording method for detection of e.g. micro-defect within module, involves determining whether test sample is formed of single material or applied on substrate
Thin medium i.e. silicon wafer, irradiating and medium penetration recording method for detection of e.g. micro-defect within module, involves determining whether test sample is formed of single material or applied on substrate
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机译:薄介质即硅片,用于检测例如模块内的微缺陷,涉及确定测试样品是由单一材料制成还是应用于基材
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摘要
The method involves bringing a thin medium i.e. silicon wafer (2), to be examined, between an X-ray radiation source (1) i.e. X-ray tube, and an imaging system i.e. camera (3), where the medium is used in photovoltaic. Sides of a test sample are irradiated. A determination is made to check whether the test sample includes a mono or polycrystalline structure. A determination is made to check whether the test sample is formed of single material or applied on a substrate, through vaporization of amorphous silicon.
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