Preparing semiconductor particles, useful e.g. to prepare wafers, comprises thermally treating semiconductor raw material, where the formation of the particles takes place by directional solidification process, and surface treating

摘要

Preparation of semiconductor particles (50, 60), comprises (a) providing particular semiconductor raw material; (b) thermally treating the particular semiconductor raw material, where the formation of the semiconductor particles takes place by directional solidification process; and (c) surface treating the semiconductor particles. An independent claim is included for the semiconductor particles obtained by the above process, in which the excess impurities are disposed inhomogeneously and locally and/or separated in the surface volume of the semiconductor particle along transverse direction (56).