Tin - electroplating bath, tin - plated coating film, tin - electroplating process, and the structural element of an electronic device

摘要

Tin - electroplating bath, comprising a water-soluble tin salt, one or more compounds selected from inorganic acids, organic acids and water-soluble salts of inorganic and organic acids, and one or more salts, selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts.