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Perforated multilayer printed circuit board for e.g. sensor in electrical/electronic circuit in punching technology, has metallic punching strips by which surface side is electrically insulated, where strips are connected to each other
Perforated multilayer printed circuit board for e.g. sensor in electrical/electronic circuit in punching technology, has metallic punching strips by which surface side is electrically insulated, where strips are connected to each other
The board has multiple metallic punching strips by which a surface side is electrically insulated, where the metallic punching strips are connected to each other. Multiple electronic elements are connected with the upmost positioned punching strip and are electrically soldered, clamped, welded by plates or soldering pads. Cooling function is provided additionally for power electronics.
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