首页> 外国专利> Perforated multilayer printed circuit board for e.g. sensor in electrical/electronic circuit in punching technology, has metallic punching strips by which surface side is electrically insulated, where strips are connected to each other

Perforated multilayer printed circuit board for e.g. sensor in electrical/electronic circuit in punching technology, has metallic punching strips by which surface side is electrically insulated, where strips are connected to each other

机译:多孔多层印刷电路板,例如冲压技术中的电气/电子电路传感器,具有金属穿孔条,通过该穿孔条将表面侧电绝缘,并且条带彼此连接

摘要

The board has multiple metallic punching strips by which a surface side is electrically insulated, where the metallic punching strips are connected to each other. Multiple electronic elements are connected with the upmost positioned punching strip and are electrically soldered, clamped, welded by plates or soldering pads. Cooling function is provided additionally for power electronics.
机译:该板具有多个金属穿孔条,通过该金属穿孔条的表面侧被电绝缘,其中金属穿孔条彼此连接。多个电子元件与最上方的冲孔带连接,并通过板或焊垫进行电焊接,夹紧,焊接。功率电子装置还额外提供冷却功能。

著录项

  • 公开/公告号DE102008004621A1

    专利类型

  • 公开/公告日2009-07-23

    原文格式PDF

  • 申请/专利权人 HESSE ANDREAS;

    申请/专利号DE20081004621

  • 发明设计人 HESSE ANDREAS;

    申请日2008-01-16

  • 分类号H05K7/02;H05K1/02;H05K7/20;H05K7/12;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:17

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