首页> 外国专利> SILVER NANOPARTICLE, COMPOSITION USING THE SILVER NANOPARTICLE, AND CONDUCTIVE COATING FILM USING THE COMPOSITION

SILVER NANOPARTICLE, COMPOSITION USING THE SILVER NANOPARTICLE, AND CONDUCTIVE COATING FILM USING THE COMPOSITION

机译:银纳米颗粒,使用银纳米颗粒的组合物以及使用该组合物的导电涂层

摘要

PROBLEM TO BE SOLVED: To obtain a conductive coating film having specific resistance close to that of metal silver by firing at a relatively low temperature, and further, to improve adhesion of the conductive coating film to a base material.;SOLUTION: Each core part of silver nanoparticles with the average particle diameter of 10 to 100 nm is composed of silver particles, the film part of each silver nanoparticle is formed on the whole or a part of the surface of the core part and is made of silver oxide or silver hydroxide. Further, the silver nanoparticles are dispersed into a dispersion medium so as to form a composition. The dispersion medium is alcohols or an alcohols-containing aqueous solution.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:通过在相对较低的温度下烧成以获得具有与金属银的电阻率接近的电阻率的导电涂膜,并且进一步提高导电涂膜对基材的粘附性。平均粒径为10〜100nm的银纳米粒子由银粒子构成,各银纳米粒子的膜部分形成在核心部分的表面的全部或一部分上,由氧化银或氢氧化银构成。 。此外,将银纳米颗粒分散到分散介质中以形成组合物。分散介质为醇类或含醇的水溶液。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010202910A

    专利类型

  • 公开/公告日2010-09-16

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20090047949

  • 发明设计人 TAKADA YOSHIAKI;

    申请日2009-03-02

  • 分类号B22F1/02;B22F1/00;H01B5/00;H01B1/22;H01B13/00;B05D1/02;B05D1/26;B05D1/40;B05D1/42;B05D3/02;B05D5/12;B05D7/24;B22F9/00;H01B5/14;

  • 国家 JP

  • 入库时间 2022-08-21 19:06:00

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