首页> 外国专利> THERMALLY CONDUCTIVE RESIN SHEET, HEAT CONDUCTION PLATE, THERMALLY CONDUCTIVE PRINTED WIRING BOARD AND RADIATING MEMBER

THERMALLY CONDUCTIVE RESIN SHEET, HEAT CONDUCTION PLATE, THERMALLY CONDUCTIVE PRINTED WIRING BOARD AND RADIATING MEMBER

机译:导热树脂板,导热板,导热印刷线路板和编织部件

摘要

PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet excellent in thermal conductivity as well as sufficient adhesion strength with a copper foil without decreasing formability, and to provide a heat conduction plate, a thermally conductive printed wiring board, and a radiating member.;SOLUTION: The thermally conductive resin sheet consists of a prepreg obtained by impregnating a carbon fiber nonwoven fabric made of carbon fibers 2 having an average fiber diameter of 0.5 to 10 μm and a fiber length of not more than 25 mm and bonded with a binder resin, with a thermosetting resin 3 containing an inorganic filler 4, wherein the sheet 1 contains a filler, as the inorganic filler, having a thermal conductivity of not less than 20 W/m×K. There are also disclosed a heat conduction plate, a thermally conductive printed wiring board, and a radiating member using the sheet.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供导热性优异并且与铜箔具有足够的粘合强度而又不降低成形性的导热性树脂片,并提供导热板,导热印刷线路板和散热构件。 ;解决方案:导热树脂片由预浸料制成,该预浸料是通过浸渍由碳纤维2制成的碳纤维无纺布而制成的,碳纤维2的平均纤维直径为0.5至10μm,纤维长度不超过25mm,并且与粘合剂树脂,其中热固性树脂3包含无机填料4,其中片材1包含导热率不小于20W / m×K的填料作为无机填料。还公开了一种导热板,导热印刷线路板以及使用该板的散热构件。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010053224A

    专利类型

  • 公开/公告日2010-03-11

    原文格式PDF

  • 申请/专利权人 KYOCERA CHEMICAL CORP;

    申请/专利号JP20080218334

  • 发明设计人 FUKUKAWA HIROSHI;NAKAMI HIROAKI;

    申请日2008-08-27

  • 分类号C08J5/24;C08L101/00;C08L63/00;C08K3/00;C08K7/06;H01L23/36;H01L23/12;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:05:52

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