首页> 外国专利> RESIN BOND GRINDING WHEEL SUITABLE FOR GRINDING OF HARD MATERIAL SUCH AS NITROGEN-ADDED CERMET AND GRINDING METHOD

RESIN BOND GRINDING WHEEL SUITABLE FOR GRINDING OF HARD MATERIAL SUCH AS NITROGEN-ADDED CERMET AND GRINDING METHOD

机译:树脂结合剂研磨轮,适合作为添加了氮的金属陶瓷研磨的硬质材料及研磨方法

摘要

PROBLEM TO BE SOLVED: To provide a grinding wheel and a grinding method for machining nitrogen-added cermet and cemented carbide at high grinding ratio.;SOLUTION: Grinding is executed by using a resin bond grinding wheel using abrasive grains of which the ratio of including diamond abrasive grains is 25-45% (55-75% in DLC ratio), and/or the X-ray diffraction intensity of diamond {311} crystal face of abrasive grain powder is 4,900-6,250 count under the condition of 70% or less of abrasive grains smoothing ratio.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于以高磨削比加工添加了氮的金属陶瓷和硬质合金的砂轮和磨削方法。解决方案:通过使用树脂砂轮进行磨削,该砂轮的磨粒比例为金刚石磨粒为25-45%(DLC比为55-75%),和/或在70%或更高的条件下,磨粒粉末的金刚石{311}晶面的X射线衍射强度为4,900-6,250。较少的磨粒平滑率。;版权所有:(C)2010,日本特许厅

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