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POWDER APPLICATION APPARATUS, AND POWDER APPLICATION METHOD

机译:粉末涂敷装置及粉末涂敷方法

摘要

PPROBLEM TO BE SOLVED: To provide a powder application apparatus and a powder application method of forming a coating film of high thickness uniformity on an object to be coated. PSOLUTION: The powder application apparatus 100 includes a shutter 4 for opening/closing the space between an object 10 to be coated and a screen electrode 1. Powder 21 is first supplied onto the screen electrode 1 from a hopper 2 with the shutter 4 kept in a closed state. A brush 8 is caused to scrape the surface of a powder layer with the shutter 4 kept in the closed state. Thus the powder 21 is uniformly laid over the screen electrode 1 without migrating to the object 10 to be coated. Subsequently a high voltage is applied between the screen electrode 1 and a transfer electrode 3 to form an electrostatic field, and the shutter 4 is put into an opened state. Thereafter, the brush 8 is caused to scrape the powder layer again to apply the powder 21 disposed on the screen electrode 1 onto the object 10 to be coated. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:<解决的问题:提供一种粉末涂布装置和粉末涂布方法,该粉末涂布装置和粉末涂布方法在被涂布物上形成高厚度均匀性的涂膜。

解决方案:粉末施加装置100包括用于打开/关闭要涂覆的物体10和屏幕电极1之间的空间的挡板4。首先,通过挡板将粉末21从进料斗2供给到屏幕电极1上。 4保持关闭状态。在百叶窗4保持关闭的状态下,使刷子8刮擦粉末层的表面。因此,粉末21均匀地铺在屏幕电极1上,而不会迁移到要涂覆的物体10上。随后,在屏幕电极1和转移电极3之间施加高电压以形成静电场,并且快门4被置于打开状态。此后,使刷子8再次刮擦粉末层,以将布置在屏幕电极1上的粉末21施加到待涂覆的物体10上。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010207780A

    专利类型

  • 公开/公告日2010-09-24

    原文格式PDF

  • 申请/专利权人 TOYOTA MOTOR CORP;

    申请/专利号JP20090059839

  • 发明设计人 KAWAOKA HIROKAZU;

    申请日2009-03-12

  • 分类号B05C19/04;B05D1/06;B05D7/24;B41F15/08;B41M1/42;

  • 国家 JP

  • 入库时间 2022-08-21 19:05:22

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