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DOUBLE-LAYER FLEXIBLE METAL INSULATOR LAMINATED SUBSTRATE, AND DOUBLE-LAYER FLEXIBLE WIRING BOARD
DOUBLE-LAYER FLEXIBLE METAL INSULATOR LAMINATED SUBSTRATE, AND DOUBLE-LAYER FLEXIBLE WIRING BOARD
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机译:双层柔性金属绝缘子叠层基板和双层柔性接线板
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摘要
PROBLEM TO BE SOLVED: To provide a double-layer flexible metal insulator laminated substrate high in adhesiveness, volume resistance, corrosion resistance, and insulation reliability, and excelling in an etching property; and a double-layer flexible wiring board high in reliability by employing the same.;SOLUTION: In this double-layer flexible metal insulator laminated substrate, a base metal layer is formed directly on at least one surface of an insulator film without interposing an adhesive, a copper conductor layer is formed on a surface of the base metal layer, and a metal layer including the base metal layer and the copper conductor layer is formed. In the double-layer flexible metal insulator laminated substrate, the base metal layer is formed of an alloy containing copper, chromium and nickel, wherein the ratio of copper is 0.5-10 wt.%, that of chromium is 15-40 wt.% and that of nickel is 50-84.5 wt.%. In this double-layer flexible wiring board, circuit wiring is formed by subjecting the double-layer flexible metal insulator laminated substrate to etching processing.;COPYRIGHT: (C)2010,JPO&INPIT
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