首页> 外国专利> CURABLE COMPOSITION FOR FILLING BETWEEN FLAT PANEL DISPLAY MODULE AND TRANSPARENT COVER BOARD, AND ELECTRIC AND ELECTRONIC DEVICE MOUNTING FLAT PANEL DISPLAY OBTAINED BY APPLYING AND CURING THE SAME

CURABLE COMPOSITION FOR FILLING BETWEEN FLAT PANEL DISPLAY MODULE AND TRANSPARENT COVER BOARD, AND ELECTRIC AND ELECTRONIC DEVICE MOUNTING FLAT PANEL DISPLAY OBTAINED BY APPLYING AND CURING THE SAME

机译:适用于平板显示器的透明面板模块和透明盖板之间的可填充组合物,以及用于安装平板显示器的电气和电子设备的固化组合物

摘要

PROBLEM TO BE SOLVED: To provide a curable composition for filling between a flat panel display module and a transparent cover board which can be cured by light at high speed, is not made uncured even in a portion which is not irradiated with light and has excellent visibility, impact resistance, heat resistance and light resistance of a cured product thereof.;SOLUTION: The curable composition contains a compound (A) having at least one hydrolyzable silyl group in one molecule on the average and a compound (B) having at least one polymerizable carbon-carbon double bond in one molecule on the average.;COPYRIGHT: (C)2011,JPO&INPIT
机译:要解决的问题:提供一种用于填充在平板显示模块和透明盖板之间的可固化组合物,该组合物可以被光高速固化,即使在没有被光照射的部分也不会被固化。解决方案:所述固化性组合物包含平均每一个分子中具有至少一个可水解甲硅烷基的化合物(A)和至少具有至少一个分子的化合物(B)。平均一个分子中有一个可聚合的碳-碳双键。;版权所有:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010248347A

    专利类型

  • 公开/公告日2010-11-04

    原文格式PDF

  • 申请/专利权人 KANEKA CORP;CHEMITEC KK;

    申请/专利号JP20090098404

  • 申请日2009-04-14

  • 分类号C08F290/06;C08F299/00;G02F1/1335;

  • 国家 JP

  • 入库时间 2022-08-21 19:04:08

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