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COMPOSITE MATERIAL STRUCTURE, CIRCUIT SUBSTRATE STRUCTURE INCLUDING COMPOSITE MATERIAL, AND METHOD OF FORMING COMPOSITE MATERIAL CIRCUIT SUBSTRATE STRUCTURE
COMPOSITE MATERIAL STRUCTURE, CIRCUIT SUBSTRATE STRUCTURE INCLUDING COMPOSITE MATERIAL, AND METHOD OF FORMING COMPOSITE MATERIAL CIRCUIT SUBSTRATE STRUCTURE
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机译:复合材料结构,包括复合材料的电路基板结构以及形成复合材料电路基板结构的方法
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摘要
PROBLEM TO BE SOLVED: To provide a circuit substrate structure containing a composite material, and to provide a method of forming a composite material circuit substrate structure.;SOLUTION: The composite material circuit substrate structure includes a substrate, a composite material dielectric layer, and a patterned conductor layer. The composite material dielectric layer is located on the substrate, and includes a catalyst dielectric layer and a passivation dielectric layer. The catalyst dielectric layer contains a dielectric material and catalyst granules and contacts the substrate. The passivation dielectric layer contains a dielectric material and contacts the catalyst dielectric layer. The patterned conductor layer is located on the catalyst dielectric layer.;COPYRIGHT: (C)2011,JPO&INPIT
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