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COMPOSITE MATERIAL STRUCTURE, CIRCUIT SUBSTRATE STRUCTURE INCLUDING COMPOSITE MATERIAL, AND METHOD OF FORMING COMPOSITE MATERIAL CIRCUIT SUBSTRATE STRUCTURE

机译:复合材料结构,包括复合材料的电路基板结构以及形成复合材料电路基板结构的方法

摘要

PROBLEM TO BE SOLVED: To provide a circuit substrate structure containing a composite material, and to provide a method of forming a composite material circuit substrate structure.;SOLUTION: The composite material circuit substrate structure includes a substrate, a composite material dielectric layer, and a patterned conductor layer. The composite material dielectric layer is located on the substrate, and includes a catalyst dielectric layer and a passivation dielectric layer. The catalyst dielectric layer contains a dielectric material and catalyst granules and contacts the substrate. The passivation dielectric layer contains a dielectric material and contacts the catalyst dielectric layer. The patterned conductor layer is located on the catalyst dielectric layer.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种包含复合材料的电路基板结构,并提供一种形成复合材料电路基板结构的方法。解决方案:复合材料电路基板结构包括基板,复合材料电介质层和图案化的导体层。复合材料介电层位于基板上,并且包括催化剂介电层和钝化介电层。催化剂介电层包含介电材料和催化剂颗粒并接触基材。钝化电介质层包含电介质材料并与催化剂电介质层接触。图案化的导体层位于催化剂介电层上。版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2010251684A

    专利类型

  • 公开/公告日2010-11-04

    原文格式PDF

  • 申请/专利权人 KINKO DENSHI KOFUN YUGENKOSHI;

    申请/专利号JP20090172168

  • 发明设计人 YU CHENG-PO;

    申请日2009-07-23

  • 分类号H05K3/46;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:34

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